Analysis and Experimental Test of Electrical Characteristics on Bonding Wire
نویسندگان
چکیده
منابع مشابه
The Quality Test of Wire Bonding
The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between t...
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ژورنال
عنوان ژورنال: Electronics
سال: 2019
ISSN: 2079-9292
DOI: 10.3390/electronics8030365